SemiWiki.com - Video EP3: A Discussion of Challenges and Strategies for Heterogeneous 3D Integration with Anna Fontanelli

Episode Date: May 2, 2025

In this episode of the Semiconductor Insiders video series, Dan is joined by Anna Fontanelli, founder and CEO of MZ Technologies. Anna explains some of the substantial challenges associated with heterogeneous 3D integration. Dan then begins to explore some of the capabilities of GenioEVO, the first integrated chiplet/package… Read More

Hello, my name is Daniel Nenni, the founder of SemiWiki, the open forum for semiconductor professionals. Welcome to the Semiconductor Insiders video series, where we take 10 minutes to discuss leading edge semiconductor design challenges with industry experts. My guest today is Anna Fontanelli, founder and CEO of MZ Technologies. Thank you for your time, Anna. You're welcome, Dan. It's a pleasure to be here today. 3D heterogeneous integration is a promising technology that improves performance and power efficiency

of microelectronic devices. But there are several technical challenges to making it a successful design approach. Anna, can you enumerate some of these challenges? Well, the first one is complexity. Designing these systems is incredibly complex due to the numerous interconnected dyes and the need to manage heat, power and signal integrity in three dimensions. System performances are affected by a combination of factors creating a multi-physics challenge.

Electrical, how signals flow through the system. Thermal, how it is generated and dissipated. And mechanical, how the structure withstands stress and strain. Yes, very complicated and challenging. And the problem is complicated by three-dimensional space, correct? Yes, the system combines Dye, Chiplet and ASICs with different functionalities and technologies. They are stacked vertically to create a 3D structure. The two things increase density and performance. This requires a high density of interconnects between the dice, creating a new technical challenge.

All in all, 3D heterogeneous integration is complex, requiring specialized tools and techniques. Interesting. So what are some of the tools and new functionalities that are required? Well, there is Gino Evo. It plays a vital role in heterogeneous 3D integration, providing a single cockpit for ASIC, chiplets,

and advanced packaging design, promoting a 3D-aware design methodology, shortening design cycles, accelerating time to manufacturing, and improving overall manufacturing yield. Gino Evo's comprehensive system view spans the entire three-dimensional design ecosystem. It is a cross-fabric platform integrated with traditional IC package and PCB design tools which allows a comprehensive system labor architecture exploration identifying the more efficient and cost-effective system solutions.

Gino Evo's complete 3D system view spans a physical implementation for early on analysis of the entire structure, embracing a simulation-aware interconnect optimization. Let's talk about Mult-physics design cockpit. So designing 3D heterogeneous systems is an incredibly complex task. There's the number of dyes, interconnect complexity and managing heat and power and signal integrity in three-dimensional space. In your opinion, what can EDA do to simplify this? Well, what I think we need to do is take multi-physics design cockpit approach.

In other words, create a specialized software environment that helps engineers design and analyze complex three-dimensional and heterogeneous integrated micro-electronic circuits while considering the interplay of various physical phenomena. Understood. But how can you manage different physical views with a single tool? That's very challenging.

I'm not thinking of a single tool, but rather a unified platform that combines views from different physics domains into a single environment. views from different physics domains into a single environment. This will enable simultaneous views and analysis of electrical, thermal, and mechanical phenomena. Understood. Can you elaborate a little bit more? Oh, sure. Gino EVO's 3D multi-physics design cockpit

provides a unified platform so that engineers can, first of all, create accurate 3D heterogeneous system views, including all the different dies and interconnects. Then optimize system floor planning and interconnects by simultaneously considering electrical, thermal and mechanical effects. And then identify potential thermal hotspots, signal delays, mechanical stress issues, and improve performance, power efficiency and reliability. Can you say more about Cheneo EVO and its design flow benefits?

The benefits are many. Improved performance, enabling the design of more powerful and efficient 3D IC heterogeneous systems. A streamlined design process that reduces the time to market. Increase reliability by identifying and mitigating potential reliability issues early in the design process. Reduce costly redesign and prototypes. And finally, Gino Evo seamlessly integrates with existing EDA tools for simulation, layout and final verification. Thank you very much, Anna. Excellent discussion and I look forward to speaking with you again because there's a lot more on this topic. My pleasure. Bye, Dan. That concludes our video. Thank you for watching and have a nice day.